In the fiercely competitive semiconductor industry, the transition from concept to high-volume manufacturing hinges on relentless process development and optimization. Advanced Semiconductor Process Development and Optimization focuses on refining manufacturing processes to meet stringent specifications with high yield and reliability. This application explores the integration of Atomic Layer Deposition (ALD) for uniform coatings in complex 3D structures, tackling the challenges posed by new materials and innovative back-end processes. Emphasizing continuous improvement, this approach uses state-of-the-art analysis methods and tools like PillarHall chips to ensure that each cycle of innovation advances closer to perfection, enhancing efficiency and profitability in semiconductor production
Home » Applications » Application 4: Advanced Semiconductor Process Development and Optimization
Advanced manufacturing processes form the foundation of every leading-edge technology. Achieving the required specifications for each process step necessitates numerous iterations of process development cycles. Beyond targeting the mean value of a parameter, controlling its variation is crucial to ensuring stable yields. While mature technologies may achieve yield rates as high as 99%, new technologies often start with much lower yields—around 20%—and require extensive optimization to reach profitability. This means that even after the initial qualification a manufacturing technology will be subject to continuous optimization with special foyus on yield and reliability.
Atomic Layer Deposition (ALD) films are increasingly favored for their high uniformity and capability to coat complex 3D structures such as 3D NAND and Gate All Around transistors, which often involve very high aspect ratios. Furthermore, the introduction of new materials, such as doped HfO2 for non-volatile memories and Ru or Mo for new Back-End-Of-Line (BEOL) processes, presents additional challenges, particularly in the analysis of films deposited in deep structures.
Traditional methods for analyzing planar films are well-established, but analyzing films in deep structures is increasingly difficult. Relying on cross-sectional methods can limit performance optimization due to the complexity and time constraints involved.
Utilizing PillarHall chips can significantly expedite the time to result in an in-Fab process development setting. When used in conjunction with our pocket wafer approach, PillarHall chips can be directly employed in manufacturing tools without any adjustments needed. This integration streamlines the development process and enhances efficiency.
Cleanroom-compatible analysis methods, such as reflectometry and the innovative imaging ellipsometer technology, are employed effectively with PillarHall chips. Notably, the imaging ellipsometer allows for the measurement of film profiles without the need to remove the membrane of the PillarHall chip, facilitating fully automated handling within contemporary wafer fabs.
Chipmetrics is a leader in the semiconductor 3D metrology, offering cutting-edge solutions for process control through its innovative test chips and wafers.
Our core technologies provide a new perspective in measuring 3D thin films within high aspect ratio device architectures, enabling precise and rapid assessments crucial for development and manufacturing.
We specialize in assisting our clients to develop new materials, optimize deposition processes, and enhance overall yields, significantly accelerating their time to market.
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