Semiconductor Manufacturing Tool Qualification

In the precise world of semiconductor manufacturing, maintaining the stability of production lines is paramount, where even minor deviations in tool performance can result in substantial financial losses. This application underscores the critical role of rigorous tool qualification, particularly focusing on the conformality of atomic layer deposition (ALD) films. Leveraging innovative PillarHall chips, our approach revolutionizes the traditional tool qualification process by drastically reducing the time required for performance assessments from hours to under an hour. This efficiency not only expedites the qualification after maintenance but also establishes a robust standard for tool acceptance tests, offering a mutually beneficial solution for manufacturers and tool providers alike.

Monitoring Tool Performance

Critical for Yield Stability

Maintaining the stability of a semiconductor manufacturing line is a monumental task that necessitates strict monitoring of each manufacturing tool’s performance. Even a minor drift in process parameters can lead to significant yield losses, potentially costing millions of dollars. This is particularly true for the conformality of deposited ALD films.

Challenges in Tool Qualification

Identifying Process Drifts

In our research we demonstrated that the across-wafer penetration depth distribution of an HfO2 film in high aspect ratio structures might be unrelated to the measured film thickness on the wafer surface. This finding underscores the necessity of monitoring film conformality. Monitoring typically requires the use of dedicated monitor wafers at frequent intervals to assess the performance of an ALD tool.[1]

PillarHall for Rapid Results

Enhancing Efficiency in Tool Qualification

The PillarHall approach significantly enhances the efficiency of this process, reducing the time to result from 12-24 hours to less than one hour. This acceleration is also beneficial during tool qualification procedures, which are typically necessary after periodic maintenance or tool-down events. By using the PillarHall chips, tools can be released for production in a substantially shorter time compared to methods that rely on cross-sectional analysis.
Furthermore, our method proves effective for tool acceptance tests and even source inspections when only limited analysis capabilities are available. Given that our chips are widely utilized by leading ALD tool manufacturers, it may be advantageous to adopt PillarHall chips as a mutually agreed standard for tool acceptance tests.

Reference

[1] Werner et. al, Ultra fast industry-compatible FEOL ALD film analysis, ALD for Industry Conference 2024

Chipmetrics

Chipmetrics is a leader in the semiconductor 3D metrology, offering cutting-edge solutions for process control through its innovative test chips and wafers.

Our core technologies provide a new perspective in measuring 3D thin films within high aspect ratio device architectures, enabling precise and rapid assessments crucial for development and manufacturing.

We specialize in assisting our clients to develop new materials, optimize deposition processes, and enhance overall yields, significantly accelerating their time to market.

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Country of origin: Finland, EU
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