Chipmetrics Webinar: Computational Modelling of (AS-)ALD
Join us for an exclusive Chipmetrics webinar featuring Prof. Dr. Ralf Tonner-Zech from Leipzig University, who will share his expertise on computational modelling in (Area Selective) Atomic Layer Deposition. Topic: Computational Modelling of (AS-)ALD: From Fundamentals to Design StrategiesDate: 25 November 2025Time: 5:00 PM CETSpeaker: Prof. Dr. Ralf Tonner-Zech, Theoretical Chemistry of Complex Matter, Faculty […]
Our Picks Ahead of ALD/ALE 2025
Anticipating Atomic Layer Innovation in South Korea As the semiconductor industry surges toward ever-more complex device architectures, ALD 2025 stands out as a premier venue for discovering the innovations that will define next-generation atomic-scale processing. From addressing high aspect ratio (HAR) challenges to developing new materials and precision etching techniques, the conference program is packed […]
Chipmetrics to Host Exclusive 3D Thin Film Metrology Workshop in Jeju – June 26, 2025
Chipmetrics announces its upcoming 3D Thin Film Metrology Workshop, taking place on June 26, 2025, at the Parnas Hotel in Jeju Island, South Korea, immediately following the ALD/ALE 2025 Conference. This one-day, in-person event offers a rare opportunity for experts and newcomers alike to come together and discuss the latest developments, challenges, and innovations in […]
Chipmetrics to Premiere PillarHall LHAR5 Test Chips for Japanese Clients at SEMICON Japan
Finnish 3D semiconductor metrology expert aims to deepen relationships with Japanese companies at SEMICON Japan 2024 trade show. Joensuu, Finland/Tokyo, Japan – December 5th, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces its participation at SEMICON Japan to be held December 11–13 in Tokyo. At SEMICON Japan, Chipmetrics will […]
Chipmetrics at SEMICON Taiwan
Finnish 3D thin film semiconductor metrology specialist to bring its solutions to the Taiwanese semiconductor industry Joensuu, Finland/Taipei, Taiwan – August 21th, 2024 – Chipmetrics Oy, a leading provider of metrology solutions for the semiconductor industry, announces its participation at SEMICON Taiwan, held September 3–6. With it, Chipmetrics will bring its latest metrology solutions, including its […]
Chipmetrics at ALD2024
Finnish 3D thin film semiconductor metrology specialist to feature heavily at ALD/ALE 2024, celebrating the 50th year of ALD. Joensuu/Helsinki, Finland – July 25th, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces its presence and activities at the ALD/ALE 2024 conference, to be held in Helsinki, August 4–7. The event will […]
PillarHall LHAR Structures at the Forefront of ALD/ALE2024 Conference
The ALD/ALE2024 conference is showcasing the PillarHall Lateral High Aspect Ratio (LHAR) test structure in numerous pivotal presentations this year. This trend underscores the importance and versatility of PillarHall structure in pushing the boundaries of conformality research and ALD technology. Key Presentations Featuring PillarHall Structures Unveiling ALD Reaction MechanismsDr. Jussi Kinnunen will discuss the influence […]
Metrology solution provider Chipmetrics to attend SEMICON West 2024
Finnish 3D metrology specialist to feature in Optoprofiler’s booth in San Francisco’s Moscone Center Joensuu, Finland/San Francisco, USA – July 1st, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces its participation at SEMICON West 2024 in cooperation with distributor Optoprofiler. In Optoprofiler’s booth 164, visitors are invited to view the latest […]
Chipmetrics unveils 300 mm product line at APCM Europe 2024
The next evolution of metrology wafers and PillarHall will be demonstrated at the Chipmetrics booth in Hamburg, April 16–18. Joensuu, Finland – April 4th, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, will premiere its new ALD/CVD (Atomic Layer Deposition/Chemical Vapor Deposition) conformality test tools for 300-millimeter processes at APCM Europe. […]
Chipmetrics from Finland to Attend JSAP Spring Meeting 2024
Helping speed up development and manufacturing of 3D semiconductor devices with Japanese companies key goal for Finnish startup, with Kokusai Electric and Meidensha R&D projects already published. Joensuu, Finland/Tokyo, Japan – March 13, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces its participation in the 71st Japan Society of Applied Physics (JSAP) […]