The PillarHall® LHAR5 and Advanced Semiconductor Process Control

In today’s fast-paced semiconductor industry, the margin for error continues to shrink with each new device node. At the same time, competition is fiercer than ever, driving the need for faster tool qualification, higher yield, and more sustainable production processes. That’s why we’re excited to introduce the fifth generation PillarHall test chip, LHAR5 – a […]
PillarHall LHAR Structures at the Forefront of ALD/ALE2024 Conference

The ALD/ALE2024 conference is showcasing the PillarHall Lateral High Aspect Ratio (LHAR) test structure in numerous pivotal presentations this year. This trend underscores the importance and versatility of PillarHall structure in pushing the boundaries of conformality research and ALD technology. Key Presentations Featuring PillarHall Structures Unveiling ALD Reaction MechanismsDr. Jussi Kinnunen will discuss the influence […]
Chipmetrics Launches New Test Chips for Advanced Atomic Layer Processes

Finnish 3D thin film semiconductor metrology specialist launches new PillarHall LHAR5 test chip with 100 nanometer gap height, complements its metrology solution with new ASD-1 chip for Area Selective Deposition. Joensuu, Finland – July 15th, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces the launch of two new test chips, the […]
Enhance Semiconductor Process Control Through Innovative Test Wafer Approaches

Chipmetrics 300 mm pocket wafer approach enables innovative test structures for fast and accurate qualification of critical thin film properties. Semiconductor manufacturing presents a complicated challenge, demanding flawless execution across hundreds of process steps to achieve optimal product yields. With the intricate timeline stretching up to three months until a wafer reaches completion, the risk […]