Finnish 3D thin film semiconductor metrology specialist to feature heavily at ALD/ALE 2024, celebrating the 50th year of ALD.
Joensuu/Helsinki, Finland – July 25th, 2024 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces its presence and activities at the ALD/ALE 2024 conference, to be held in Helsinki, August 4–7. The event will be the first chance for engineers and conference visitors to experience the newly launched PillarHall LHAR5 and ASD-1 test chips in a public setting.
Chipmetrics will make its presence felt at ALD/ALE 2024 in no less than two booths, its own as well as a joint booth with Park Systems. The latter will allow for on-site testing of ALD (Atomic Layer Deposition) and CVD (Chemical Vapor Deposition) film growth on PillarHall test chips.
“We are excited to demonstrate our latest test chips, including the PillarHall LHAR5 and ASD-1 products. It is especially great to be able to demonstrate the quick and non-destructive ALD/CVD deposition workflow that we enable with the help of Park Systems,” says Mikko Utriainen CEO at Chipmetrics. “It is fitting that ALD returns home to its birthplace Finland, for its 50th birthday. We look forward to welcoming visitors to our booth, the many interesting seminars and to join in on the festivities.”
During the spring of 2024, Chipmetrics has also hosted a conformality research competition with an eye on accelerating development of next-gen 3D semiconductor devices. As part of the ALD/ALE 2024 festivities the winners of the contest will be announced at Chipmetrics booth, with participants from North America, Europe and East Asia.
Chipmetrics Presentations and Poster Sessions at ALD/ALE 2024
Presentations and poster sessions are at the very core of ALD/ALE 2024, and Chipmetrics will be a headlining act in two of these. On August 7th, 9:00 AM (EEST), Dr. Jussi Kinnunen, General Manager at Chipmetrics, will discuss the influence of precursor pressure on secondary growth fronts in ALD processes. Kinnunen’s presentation is on sophisticated 3D ALD structural analysis, PillarHall Lateral High Aspect Ratio Assisted Unveiling of Secondary Growth Front and Background Reaction Mechanism in Atomic Layer Deposition, to be held in Room Hall 3A.
Thomas Werner, Head of Metrology Wafer Business at Chipmetrics, will host a poster session title Accurate and Fast Wafer Level Conformality Analysis Method for ALD Films, addressing the impact of precursor inlet and outlet dynamics on film thickness and penetration in ALD processes. This presentation is part of the poster session ALD for Manufacturing, to be held on August 5th, from 5:45 to 7:00 PM (EEST) in Room Hall 3.
ALD/ALE 2024 kicks off on August 4th, with over 700 attendees expected to visit Helsinki’s Messukeskus. Aside from Chipmetrics, industry heavyweights such as Applied Materials, ASM, Tokyo Electron and Veeco will be exhibiting and providing keynote speakers. For the full program, see the event website. For more information on Chipmetrics, visit www.chipmetrics.com.
About Chipmetrics
Chipmetrics Oy develops and delivers metrology solutions for manufacturing processes for the semiconductor industry, focusing on innovative metrology chips and ALD measurement services. Its main product is the PillarHall® metrology chip for near-instantaneous thin film process conformality measurement. Founded in 2019, its head office is in Joensuu, Finland, with employees and sales partners in Japan, South Korea, USA, and Germany.
For more information, visit www.chipmetrics.com.
Press contact:
Jonas Klar
Chipmetrics Oy
[email protected]
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Editor’s note on ALD:
Atomic Layer Deposition (ALD) is a precision thin-film deposition technique crucial for semiconductor manufacturing, enabling the production of uniform and conformal layers essential for microelectronic devices. Through alternating exposure to precursor gases that react with the substrate in a self-limiting manner, ALD achieves atomic-level control over film thickness and composition. This method ensures exceptional uniformity across complex geometries, vital for the miniaturized, multi-layered structures such as the future’s 3D chips in advanced semiconductor devices, keeping Moore’s Law alive.
Finland plays a key role in the ALD landscape, having pioneered the process in the 1970s. Finland’s contribution to ALD includes significant advancements in materials science, equipment design, and the exploration of new applications ranging from electronics to renewable energy sectors. The country’s strong emphasis on research and development in nanotechnology has positioned it as a hub for ALD innovation, fostering collaborations between academia, industry, and research organizations worldwide.