Chipmetrics Establishes Dresden-Based Subsidiary

A world map with illuminated connection points symbolizing global reach, highlighting Chipmetrics' expansion to Dresden, Silicon Saxony. The Chipmetrics logo is visible in the top-right corner, with text reading 'Chipmetrics settles in Dresden Silicon Saxony' in bold.

Dresden, Germany – January 13, 2025 –Chipmetrics is proud to announce its new Dresden-based German subsidiary, Chipmetrics GmbH. Originally hailing from Finland’s Joensuu, 2025 is set to be an important year for the company as it aims to aggressively scale both sales and marketing of its 3D semiconductor metrology products.

Especially important is Chipmetrics’ tool qualification efforts, which will get a boost from added presence in Europe’s silicon heartland, or Silicon Saxony. The company’s metrology products and services, spearheaded by the 300-millimeter compatible PillarHall high-aspect ratio test chips, are uniquely positioned to help expedite post-maintenance qualification and offer a standard for tool acceptance tests. This speeds up time to production for chip manufacturers as well as tool providers, benefiting everyone.

“Dresden is Europe’s most important semiconductor location, and formally being here with Chipmetrics is going to open up doors for us,” says Thomas Werner. “The German entity allows us to not only better serve our European clients and develop business here, but as we’re expanding it also allows us to hire people who are perhaps better integrated into the 300-millimeter semiconductor ecosystem than we could in Finland.”

Keen-eyed followers of Chipmetrics may have already spotted job openings that offer a choice of locale, with positions such as COO (Chief Operating Officer), Sales Manager and ALD Scientist being published during the holiday season – all positions available in either Dresden or Finland. With the expansion plans for 2025, Chipmetrics is looking to fill not only these positions, but will likely offer further opportunities down the line.

Chipmetrics’ main products address some of the most pressing challenges in modern semiconductor manufacturing: as component structures shrink to near-atomic scales, the industry increasingly embraces three-dimensional chip architectures. Thin layers are deposited using Atomic Layer Deposition (ALD) – a technology originally pioneered in Finland in 1974 – to reliably coat deep chip structures with extraordinary precision.

The ability to accurately measure ALD data in 3D structures with high aspect ratios aids both R&D efforts for future chips such as 3D DRAM as well as tool qualification and process control.

“AI and Machine Learning are here to stay, especially in automated production processes as the ones we see in semiconductors. With our metrology chips and wafers, we can speed up the tool qualification process, minimizing downtime as well as providing the best possible data to train AI/ML models on.” continues Werner. “If you’re interested in shaping the future of semiconductors, get in touch!”

Chipmetrics

Chipmetrics is a leader in the semiconductor 3D metrology, offering cutting-edge solutions for process control through its innovative test chips and wafers.

Our core technologies provide a new perspective in measuring 3D thin films within high aspect ratio device architectures, enabling precise and rapid assessments crucial for development and manufacturing.

We specialize in assisting our clients to develop new materials, optimize deposition processes, and enhance overall yields, significantly accelerating their time to market.