The Finnish Centre for Economic Development, Transport and the Environment awards semiconductor metrology experts more than 300,000 euro for business and product development.
Joensuu, Finland – January 20, 2025 – Chipmetrics Oy, an innovative metrology solutions provider to the semiconductor industry, announces the receipt of regional grants from the Finnish Centre for Economic Development, Transport and the Environment (ELY, Elinkeino-, liikenne- ja ympäristökeskus) totalling 311,349 euro. The funds were granted to Chipmetrics for systematic development of both its business as well as its product offering under the Systemic Offering and Growth Development project (SYKE, Systeemisen tarjoaman ja kasvun kehittämishanke).
To date, the ELY grant has allowed Chipmetrics to develop its 300-millimeter pocket wafer concept, which allows the company’s test chips to be used in high-volume, leading edge semiconductor manufacturing. The pocket wafer allows for products such as Chipmetrics’ flagship metrology chip PillarHall, VHAR1 (Vertical High Aspect Ratio) and ASD-1 (Area Selective Deposition) to seamlessly integrate into semiconductor related R&D processes and for process control.
With its focus on high aspect ratio metrology, Chipmetrics is enabling the chips of the future, which will utilize 3D stacking to a higher degree than today’s semiconductors. The company’s products have already found success in the Asian semiconductor hotbed, where the most advanced chips are being produced and developed.
“Our goal is to deliver integrated system solutions that meet the highest automation and quality demands at the top levels of the semiconductor industry,“ says Jussi Kinnunen, General Manager at Chipmetrics. “This is a highly capital-intensive market. We are grateful for the ELY funding that allows us to expand not only our product portfolio, but also create new jobs in Joensuu. We could have production line alongside our headquarters and R&D center here in five years’ time.”
“It is absolutely crucial to have 300-millimeter metrology solutions in order to be relevant to leading-edge semiconductor players,” comments Thomas Werner, Head of Metrology Wafer Business at Chipmetrics. “With the 300-millimeter pocket wafers Chipmetrics has a fully modular metrology ecosystem that gives R&D and process control engineers faster-than-ever access to data, no matter what sort of 3D chips they’re working on.”
For more information on Chipmetrics and its metrology solutions, visit Chipmetrics.com.