Chipmetrics to Host Exclusive 3D Thin Film Metrology Workshop in Jeju – June 26, 2025

Chipmetrics announces its upcoming 3D Thin Film Metrology Workshop, taking place on June 26, 2025, at the Parnas Hotel in Jeju Island, South Korea, immediately following the ALD/ALE 2025 Conference.

This one-day, in-person event offers a rare opportunity for experts and newcomers alike to come together and discuss the latest developments, challenges, and innovations in thin film metrology—particularly in high aspect ratio (HAR) structures that are critical to today’s semiconductor and advanced manufacturing industries.

Why Attend?

As semiconductor devices continue to scale down while structures grow increasingly complex, the demand for accurate and non-destructive thin film measurement methods has never been greater. The workshop will bring together leading voices in the field to:

  • Share insights into next-generation 3D metrology and process control
  • Provide hands-on training using our proprietary PillarHall® test chips
  • Address conformality measurement challenges in HAR structures
  • Facilitate peer-to-peer learning through roundtable discussions
  • Offer valuable networking opportunities over coffee, lunch, and evening refreshments

Highlights:

  • Keynote Presentation on cutting-edge metrology solutions for 3D thin film process control
  • Hands-on Session with PillarHall®: Get real experience using our lateral high aspect ratio test chips
  • Interactive Roundtables to exchange ideas and explore future directions in thin film characterization

Event Details:

Date: June 26, 2025
Location: Parnas Hotel, Jeju Island, South Korea

Register Now

Seats are limited, and interest is already building, so we strongly encourage early registration.

👉 Register Here
📄 Download the Workshop Flyer

Join us in beautiful Jeju Island for a day of insight, learning, and collaboration in the field of 3D thin film metrology. We look forward to seeing you there!

Chipmetrics

Chipmetrics is a leader in the semiconductor 3D metrology, offering cutting-edge solutions for process control through its innovative test chips and wafers.

Our core technologies provide a new perspective in measuring 3D thin films within high aspect ratio device architectures, enabling precise and rapid assessments crucial for development and manufacturing.

We specialize in assisting our clients to develop new materials, optimize deposition processes, and enhance overall yields, significantly accelerating their time to market.