As semiconductor devices continue to shrink and performance demands rise, advanced techniques become indispensable for manufacturers seeking to stay ahead of the technological curve. One such technique is area selective deposition (ASD). ASD enables the precise deposition of materials on specific regions of a wafer while preventing deposition on unwanted areas. This approach holds significant promise for improving device performance, reducing manufacturing steps, and ultimately driving down costs for a broad range of semiconductor applications, including logic, memory, and sensor devices.
Introducing the Chipmetrics ASD-1 Test Chip
To help semiconductor manufacturers harness the power of ASD, Chipmetrics has expanded its already pioneering advanced test chip portfolio to include the ASD-1. This cutting-edge chip is specially designed for rapid process development, verification, and benchmarking of ASD techniques. By integrating sub-100 nm linewidth test structures that feature alternating materials at the same surface level, the ASD-1 enables researchers and engineers to refine ASD processes with speed and precision.
Below, we explore the key benefits of the ASD-1 test chip and the associated ASD services that streamline the manufacturing process – from concept to production.
Benefits of the ASD-1 Test Chip
- Rapid Process Development and Verification
The ASD-1 serves as a test vehicle that allows you to investigate and validate new ASD processes swiftly. This expedites learning cycles, helping you bring innovative processes into high-volume production faster. - Fine Linewidth Control
With sub-100 nm linewidth test structures and excellent linewidth roughness (LWR) of less than 10 nm, the ASD-1 provides the precise geometry needed to evaluate deposition performance at advanced technology nodes. This capability is invaluable for assessing film deposition selectivity and critical dimension control. - Alternating Materials in a Single Pass
The carefully engineered test structures feature alternating materials at the same surface level, offering deeper insights into how different materials behave under the same deposition conditions. This unique arrangement helps you to optimize process parameters for film deposition selectivity on the alternating materials, especially at the narrow linewidth patterns. - Wide Range of Materials
From metals to dielectrics, the ASD-1 accommodates a broad variety of material selections. This flexibility is crucial given the expanding range of materials being considered for next-generation semiconductor devices (e.g., complex metal alloys, high-k dielectrics, etc.).
ASD Services that Accelerate Your Path to Production
Beyond the test chip itself, Chipmetrics provides a suite of ASD services designed to simplify R&D and production workflows:
- Pocket Wafer Combined Service with Multiple Wafer Sizes
We offer a pocket wafer service that allows you to combine different wafer sizes in a single process run. Whether it’s 200 mm, 300 mm, or even niche wafer sizes, this service optimizes resources and lowers costs by reducing the need for multiple, separate runs. - Wide Range of Material Selections
Much like the ASD-1 chip, our ASD service capabilities support a wide range of materials. You can efficiently test new metallic compounds, metal oxides, nitrides, and more – giving you freedom to innovate and push boundaries without the usual equipment restrictions. - Elevated vs. Planar Structures
Our ASD process flow can include elevated structures, which may confer advantages over strictly planar test structures. Elevated topography can help uncover unique deposition behaviors, helping you more accurately anticipate performance challenges (like sidewall coverage and step coverage) in real-world devices.
Why Choose the Chipmetrics ASD-1 Chip and our Services?
By pairing the ASD-1 test chip with our end-to-end ASD services, you can confidently develop and refine area selective deposition processes that meet both current and future device manufacturing requirements. Our goal is to help you:
- Shorten time-to-market by accelerating prototyping and testing phases.
- Achieve tighter geometries with lower defects due to excellent LWR control.
- Minimize cost by consolidating tests onto pocket wafers of various sizes.
- Explore an expansive combination of materials for next-generation device concepts.
Whether you’re looking to perfect an existing ASD process or explore entirely new material choices, the ASD-1 test chip and our integrated ASD services can provide you with the data, flexibility, and scalability you need. We invite you to contact us to learn how these solutions can revolutionize your process R&D and help you drive innovation in your semiconductor manufacturing pipeline.
