Atomic Layer Deposition (ALD) has become the go-to solution for coating complex 3D structures in semiconductor manufacturing and advanced packaging. But achieving uniform, conformal coatings in high-aspect-ratio (HAR) features remains a major challenge, especially when traditional measurement tools fall short. That’s where the PillarHall chip comes in.
At Chipmetrics, we’ve developed the PillarHall chip specifically for precision ALD process development and long-term monitoring. Whether you’re optimizing tool parts coatings or fine-tuning protective layers in advanced packaging, PillarHall helps you get it right and keep it consistent.
What Makes PillarHall a Game-Changer?
With PillarHall, process engineers can:
- Establish a reliable baseline using standard process parameters.
- Fine-tune ALD settings like precursor pulse time, purge duration, and temperature.
- Visualize conformality and penetration in high aspect ratio structures.
- Validate performance across tool conditions, precursor ages, and more.
- Track long-term process stability, spotting deviations early to avoid production issues.
Our five-chip package makes it easy to compare data points, identify variability, and achieve repeatable results.
From Lab to Line, With Confidence
The PillarHall chip isn’t just for development. It’s built for ongoing monitoring, helping fabs maintain deposition quality over time—even as precursors age or tools require cleaning.
Want to go a step further? Our High Aspect Ratio – HAR Calculator lets you translate PillarHall chip results to your actual product dimensions. This means fewer trial-and-error runs and more accurate, efficient process control.
Ready to Improve Your ALD Process?
Download the white paper now to discover how PillarHall test solutions can streamline your process development and boost deposition precision from day one.
Download the White paper from Here.
