PillarHall Lateral High Aspect Ratio (LHAR) silicon test chip contains Lateral High Aspect Ratio test structures for ALD and CVD thin film characterization. It is used as a measurement tool for thin film conformality and thin film side wall properties in a deep trench.
Benefits
- Accurate, fast and easy measurements
- No cross-sectioning, no destructive sampling
- Ultra high aspect ratios (>1000)
- Simple measurements by existing lab tools
- Wide compatibility to various conditions (temperature, pressure)
Fast and easy measurement tool
Conformality is challenging to measure and quantify since standardized measurement methods do not exist. Traditional vertical test structures typically rely on tedious and time-consuming cross-sectional SEM/TEM analyses. The lateral 3D approach of PillarHall® enables fast, easy, and accurate measurement without cross-sectioning and destructive sampling.
Applications
- Conformality in ALD/CVD
- Properties of the film on the side wall
- Plasma-enhanced ALD/CVD development
- Kinetic modeling of ALD/ALE
- Quality control and assurance
- Comparison between processes
- Wafer level conformality measurements
1. Deposit the thin film
2. Remove the top membrane
3. Measure
