Optical measurements on Chipmetrics metrology chips and wafers provides unique experimental data. Measurement will quantify film conformality and allows analyzing reaction kinetics factors. Fast and accurate conformality information.
Chipmetrics 3D Metrology Service
SCANNING ELECTRON MICROSCOPE (SEM)
Single chip measurements Contrast imaging when the deposited thin film is dielectric or sufficiently different from silicon Lateral resolution down to single nanometers.
The film penetration depth profile represents film thicknesses at different depths in the Lateral High Aspect Ratio (LHAR) trench.
100mm x 100mm stage travel
Wide range of measurements for
different films and surfaces
Film thickness and conformality
Spot size down to 7 microns + F40.jpg Image
300 mm wafer measurement. Wide range of measurements of materials including metals, dielectrics, and semiconductors.
Film thickness, conformality, refraction index, surface topography and uniformity.
Rapid imaging for high throughput analysis Lateral resolution down to 1 micron.
Single chip measurements Contrast imaging when the deposited thin film is dielectric or sufficiently different from silicon Lateral resolution down to single nanometers
Chipmetrics is a leader in the semiconductor 3D metrology, offering cutting-edge solutions for process control through its innovative test chips and wafers.
Our core technologies provide a new perspective in measuring 3D thin films within high aspect ratio device architectures, enabling precise and rapid assessments crucial for development and manufacturing.
We specialize in assisting our clients to develop new materials, optimize deposition processes, and enhance overall yields, significantly accelerating their time to market.
ISO 9001:2015 compliant. IC cleanliness certified
Country of origin: Finland, EU
Registered exporter FIREX31010316
Address: Yliopistokatu 7, Photonics center
80130, Joensuu, Finland
phone: +358 10 348 1344
E-mail: [email protected]
