Chipmetrics at ALD2024 Finnish 3D thin film semiconductor metrology specialist to feature heavily at ALD/ALE 2024, celebrating the 50th year of ALD. Joensuu/Helsinki, Finland –
PillarHall LHAR Structures at the Forefront of ALD/ALE2024 Conference The ALD/ALE2024 conference is showcasing the PillarHall Lateral High Aspect Ratio (LHAR) test structure in numerous
Chipmetrics Launches New Test Chips for Advanced Atomic Layer Processes Finnish 3D thin film semiconductor metrology specialist launches new PillarHall LHAR5 test chip with 100 nanometer
Metrology solution provider Chipmetrics to attend SEMICON West 2024 Finnish 3D metrology specialist to feature in Optoprofiler’s booth in San Francisco’s Moscone Center Joensuu, Finland/San Francisco,
Puolijohdealan ammattilaisia nimitetty Chipmetrics Oy:n hallitukseen Joensuu, Suomi – 5. kesäkuuta 2024 Chipmetrics Oy on nimittänyt kaksi kokenutta puolijohdealan ammattilaista, Jukka Niemisen ja Satu
Seasoned Semiconductor Professionals Appointed to Chipmetrics’ Board of Directors Joensuu, Finland – June 5, 2024 Chipmetrics is proud to announce the appointment of two experienced
PillarHall for exploring the reaction mechanism beyond the conventional conformality measurements. In the fast-paced world of semiconductor manufacturing, the demand for precision and perfection has
Enhance Semiconductor Process Control Through Innovative Test Wafer Approaches Chipmetrics 300 mm pocket wafer approach enables innovative test structures for fast and accurate qualification of
Chipmetrics unveils 300 mm product line at APCM Europe 2024 The next evolution of metrology wafers and PillarHall will be demonstrated at the Chipmetrics booth
Chipmetrics from Finland to Attend JSAP Spring Meeting 2024 Helping speed up development and manufacturing of 3D semiconductor devices with Japanese companies key goal for
Chipmetrics Oy keräsi 2.4 miljoonan euron pääomarahoituksen 24.01.2024 – Joensuu, Suomi. Atomic Layer Deposition (ALD) teknologiaan erikoistunut yritys Chipmetrics Oy, joka on haastavien 3D metrologia
Chipmetrics Secures € 2.4 Million Seed Funding Round to Accelerate Product Innovation and Global Expansion. 24.01.2024– Joensuu, Finland Chipmetrics Ltd, the Atomic Layer Deposition (ALD)
Chipmetrics Joins Silicon Saxony: A New Era of Technological Synergy Chipmetrics has officially become a member of Silicon Saxony, one of Europe’s largest and most
Chipmetrics webinar: Insights to conformality modeling Chipmetrics recently hosted an enlightening webinar focused on insights to conformality modeling. Held on November 29, 2023, the webinar
Webinar on ” Unlocking the secrets of conformality, Plasma-Enhanced ALD Our enlightening webinar, “Unlocking the Secrets of Conformality: Plasma-Enhanced ALD,” featuring Professor Erwin Kessels, is now
MEIDENSHA uses PillarHall® Test Chip to develop Pure Ozone Generator for ALD applications. MEIDEN NANOPROCESS INNOVATIONS INC., located in Chiba, Japan, holds significant expertise in
The recent ALDALE 2023 conference in Bellevue witnessed the growing use of PillarHall chips in thin film conformality research. It was remarkable to see PillarHall
Conformality Research Competition 50th anniversary of ALD will be celebrated in AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) in August 2024 in
Webinar on Metrology toolbox for ALD processing in high aspect ratio structures. Expert Insights and Innovative Solutions in Conformality Measurements for ALD Processes. We are
Kokusai Electric relies on patterned 3D substrates in thin film process metrology Kokusai Electric is one of the leading semiconductor thin film process equipment manufacturers
Chipmetrics Oy, Atomic Layer Deposition (ALD)-teknologiayritys ja ALD-prosessien mittaamiseen kehitettyjen tuotteistettujen 3D-testirakenteiden markkinajohtaja, on saanut päätökseen siemenrahoituskierroksensa. Sijoituskierrosta johti Redstone Pohjois-Karjalan pääomasijoitusrahastonsa kautta yhdessä neljän
05.09.2022 – Joensuu, Finland Chipmetrics Ltd, the ALD (Atomic Layer Deposition) technology company and the market leader of productized 3D ultra-high aspect ratio test elements