PillarHall LHAR4 silicon test chip contains Lateral High Aspect Ratio test structures for ALD and CVD thin film characterization. It is used as a measurement tool for thin film conformality and thin film side wall properties in a deep trench.
PillarHall’s innovative approach reduces measurement costs by eliminating the need for destructive sample preparation, special analytical tools, specialist users, and special expensive services.
Conformality is challenging to measure and quantify since standardized measurement methods do not exist. Traditional vertical test structures typically rely on tedious and time-consuming cross-sectional SEM/TEM analyses. The lateral 3D approach of PillarHall® enables fast, easy, and accurate measurement without cross-sectioning and destructive sampling.